| 摘要 |
<p>PURPOSE:To provide a semiconductor device of high long-term reliability where a chip is mounted on a circuit board through the intermediary of solder bumps in a flip-chip bonding manner and a semiconductor device manufacturing method excellent in connection worke. CONSTITUTION:A semiconductor element (chip) 1 is mounted on a circuit board 2 through the intermediary of solder bumps 3 and connected to the wiring layer 8 of the circuit board 2, and a first resin 41 and a second resin 42 different from each other in Young'modulus are filled between the semiconductor element 1 and the circuit board 2. The first resin 41 which fills a gap between the chip 1 and the circuit board 2 and located under the center of the chip is higher in Young'modulus and harder than the second resin 42, so that it is capable of fixing enough the chip 1. Furthermore, the first resin 41 contains filler but the second resin 42 contains no filter, so that the second resin 42 is made to easily penetrate a narrow gap between the chip 1 and the circuit board 2. Even after a semiconductor device is repeatedly used, the center of the chip 1 is fixed by the first resin 41, so that a displacement difference between the upside and underside of a solder bump is small, and a semiconductor device of this constitution is prevented from deteriorating in long-term reliability.</p> |
