发明名称 Vacuum processing method and apparatus
摘要 <p>This invention relates to a vacuum processing method and apparatus. When a sample (6) is plasma-processed under a reduced pressure, a sample bed (5,7) is cooled by a cooling medium (10) kept at a predetermined temperature lower than the desired processing temperature. The sample is held on the sample bed. To control the sample temperature, a heat transfer gas is supplied between the back of the sample and the sample installation surface of the sample bed, and the pressure of the heat transfer gas is controlled so as to bring the sample to a predetermined processing temperature. In this way, a sample temperature can be regulated rapidly without increasing the size of the apparatus. <IMAGE></p>
申请公布号 EP0465185(B1) 申请公布日期 1999.02.17
申请号 EP19910305929 申请日期 1991.07.01
申请人 HITACHI, LTD. 发明人 TSUBONE, TSUNEHIKO;TAMURA, NAOYUKI;KATO, SHIGEKAZU;ITOU, ATSUSHI;NISHIHATA, KOUJI
分类号 C23C14/50;C23C14/54;C23C16/458;C30B33/00;H01L21/00;(IPC1-7):H01L21/00 主分类号 C23C14/50
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