Test method of chips in a semiconductor wafer employing a test algorithm

摘要

Sample chips are tested after determining the chip layout on a semiconductor wafer so that one or plural ones of untested chips are surrounded by plural ones of the sample chips that adjoin the untested samples. A good/defective judgment on the untested chips is performed by using predicted good/defective judgment results that are statistically predicted based on results of the sample test and stored statistical data of a defect generation profile including address information that indicates defective chip locations. As a result, the good/defective judgment can be performed with high accuracy even in a case where defective chips are localized in a particular region on the wafer in a concentrated manner.