发明名称 Substrate supports for use with programmable material consolidation apparatus and systems
摘要 A programmed material consolidation apparatus includes at least one fabrication site and a material consolidation system associated with the at least one fabrication site. The at least one fabrication site may be configured to receive one or more fabrication substrates, such as semiconductor substrates. A machine vision system with a translatable or locationally fixed camera may be associated with the at least one fabrication site and the material consolidation system. A cleaning component may also be associated with the at least one fabrication site. The cleaning component may share one or more elements with the at least one fabrication site, or may be separate therefrom. The programmed material consolidation apparatus may also include a substrate handling system, which places fabrication substrates at appropriate locations of the programmed material consolidation apparatus.
申请公布号 US2004186608(A1) 申请公布日期 2004.09.23
申请号 US20030705409 申请日期 2003.11.10
申请人 HIATT WILLIAM M.;FARNWORTH WARREN M.;HEMBREE DAVID R.;BENSON PETER A. 发明人 HIATT WILLIAM M.;FARNWORTH WARREN M.;HEMBREE DAVID R.;BENSON PETER A.
分类号 B29C67/00;(IPC1-7):G06F19/00 主分类号 B29C67/00
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