发明名称 CURABLE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable resin composition not only extremely excellent in adhesion with a base material and excellent in chemicals resistance, but also capable of obtaining a cured form having high hardness. <P>SOLUTION: The curable resin composition comprises: a copolymer A containing at least a monomer unit represented by Formula (1) (where R<SP>1</SP>represents a hydrogen atom or a methyl group, R<SP>2</SP>represents a 1-8C divalent aliphatic saturated hydrocarbon group; and R<SP>3</SP>represents a residue of a blocking agent R<SP>3</SP>H for an isocyanate group), corresponding to a vinyl monomer (a) having a blocked isocyanate group, and a monomer unit corresponding to a vinyl monomer b having a 3- to 5-membered cyclic ether group; and a block polyisocyanate compound B. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010106074(A) 申请公布日期 2010.05.13
申请号 JP20080277368 申请日期 2008.10.28
申请人 DAICEL CHEM IND LTD 发明人 NIJUKKEN TOSHIHIKO;NAKAGAWA YASUNOBU
分类号 C08L33/14;C08K5/29 主分类号 C08L33/14
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