SEMICONDUCTOR PACKAGING DEVICE

摘要

PURPOSE: A semiconductor packaging apparatus is provided to secure a space in which semiconductor components are mounted by exposing a filling layer and the upper side of the semiconductor groups. CONSTITUTION: A plurality of first semiconductor package groups(SPG1) is arranged on a base plate(10). A side pillar(66) is upwardly expanded from the main surface of the base plate. A filling layer is contacted to the side pillar and is arranged between the first semiconductor package groups. Each of first semiconductor package group includes a semiconductor package. The side pillar is contacted to the lateral sides of the first semiconductor package groups.