Method for coating and bonding substrates

摘要

A method for coating of a first substrate with a first diffusion bond layer by deposition of a first material which forms the first diffusion bond layer on a first surface of the first substrate such that the first diffusion bond layer forms a grain surface with an average grain diameter H parallel to the first surface smaller than 1 μm. The invention further relates to a method for bonding of a first substrate which has been coated as described above to a second substrate which has a second diffusion bond layer, the method of the bonding comprising the following steps: bring a first diffusion bond layer of a first substrate into contact with a second diffusion bond layer of a second substrate, pressing the substrates together to form a permanent metal diffusion bond between the first and second substrates.

主权项

1. A method of coating a first substrate with a first diffusion bond layer, the method comprising:
forming a first intermediate layer on a first surface of the first substrate, the first intermediate layer having an average grain diameter H′ parallel to the first surface and an average grain diameter V′ transverse to the first surface; and depositing the first diffusion bond layer on the first intermediate layer, the first diffusion bond layer being formed of a first material and having an average grain diameter H parallel to the first surface and an average grain diameter V transverse to the first surface, the average grain diameter H being less than 1 μm, wherein the average grain diameter H′ is greater than the average grain diameter H, and wherein the average grain diameter V′ is greater than the average grain diameter V.