| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module which achieves downsizing.SOLUTION: A power module 102 includes: an insulating substrate 150; a conductor pattern 03 formed on the insulating substrate; a power semiconductor element 200 mounted on the conductor pattern; a terminal member 1 soldered to the conductor pattern and connected with an external conductor 501 extending from an exterior part; and a nut 20 with which a bolt 550 for joining the terminal member to the external conductor threadedly engages. The terminal member has: a joint part 1A formed by folding a metal plate and soldered to the conductor pattern; a nut holding part 1B which is positioned above the joint part so as to be arranged parallel to the joint part and holds the nut; and a bolt fastening part 1D which is positioned above the nut holding part so as to be arranged parallel to the nut holding part and has a bolt insertion hole 1Da at a position facing a screw hole 21 of the nut held by the nut holding part.SELECTED DRAWING: Figure 1 |
