发明名称 Suspension processing device using ultrasonic waves
摘要 A suspension processing method using ultrasonic waves has problems in that movement of solids in liquid do not follow movement of the sound field. Accordingly, application to a field that requires a high suspension processing performance or a high flow rate process is difficult. In order to achieve the high suspension processing performance, a design of adopting a long and large oscillator and the like is required. A suspension processing device (30) of separating and concentrating a component of solids in suspension (1a) using ultrasonic waves, includes: at least one supply port (32) for supplying the suspension (1a) into the device; a channel (31) through which the suspension flows; at least two outlet ports (33 and 34) for discharging processed suspension (1a); an oscillator (35) for emitting ultrasonic waves; and a reflection plate (36) for reflecting the emitted ultrasonic waves.
申请公布号 US9375662(B2) 申请公布日期 2016.06.28
申请号 US201314425929 申请日期 2013.08.07
申请人 Hitachi, Ltd.;Tokyo Institute of Technology 发明人 Kambayashi Takuya;Nakamura Kentaro
分类号 B01D21/28;B01D43/00;B01J19/10;C02F1/36;B01D21/00 主分类号 B01D21/28
代理机构 Crowell & Moring LLP 代理人 Crowell & Moring LLP
主权项 1. A suspension processing device for separating and concentrating a component of solids in suspension using ultrasonic waves, comprising: at least one supply port for supplying the suspension into the device; a channel through which the suspension flows; at least two outlet ports for discharging processed suspension; an oscillator for emitting the ultrasonic waves; and a reflection plate for reflecting the emitted ultrasonic waves; wherein the at least two outlet ports include a first outlet port provided adjacent to the oscillator and a second outlet port provided adjacent to the reflection plate; and wherein the oscillator includes an opening in a central portion thereof through which the suspension flows, and the first outlet port is provided directly above the opening.
地址 Tokyo JP