| 发明名称 | Double-sided cooling power module and method for manufacturing the same | ||
| 摘要 | A double-sided cooling power module may include a lower-end terminal, at least one pair of power semiconductor chips mounted on the lower-end terminal, at least one pair of horizontal spacers mounted on the at least one pair of power semiconductor chips, an upper-end terminal mounted on the at least one pair of horizontal spacers, and at least one pair of vertical spacers disposed between the upper-end terminal and the lower-end terminal. | ||
| 申请公布号 | US9390996(B2) | 申请公布日期 | 2016.07.12 |
| 申请号 | US201514865578 | 申请日期 | 2015.09.25 |
| 申请人 | Hyundai Motor Company | 发明人 | Jeon Woo-Yong |
| 分类号 | H01L25/00;H01L23/367;H01L25/18;H01L23/043;H01L23/373;H01L23/492;H01L23/31;H01L23/00;H01L21/52;H01L21/48;H01L21/56;H01L25/16 | 主分类号 | H01L25/00 |
| 代理机构 | Mintz Levin Cohn Ferris Glovsky and Popeo, P.C. | 代理人 | Mintz Levin Cohn Ferris Glovsky and Popeo, P.C. ;Corless Peter F. |
| 主权项 | 1. A double-sided cooling power module comprising: a lower-end terminal; at least one pair of power semiconductor chips mounted on the lower-end terminal; at least one pair of horizontal spacers mounted on the at least one pair of power semiconductor chips; an upper-end terminal mounted on the at least one pair of horizontal spacers; and at least one pair of vertical spacers disposed between the upper-end terminal and the lower-end terminal. | ||
| 地址 | Seoul KR | ||