CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF

摘要

This present invention provides a chip scale sensing chip package, comprising a sensing chip having a first top surface and a first bottom surface opposite to each other, a touch plate having a second top surface and a second bottom surface opposite to each other, formed above the sensing chip, and a color layer, sandwiched between the sensing chip and the touch plate, wherein the sensing chip comprises a sensing device formed nearby the first top surface and a plurality of conductive pads formed nearby the first top surface and adjacent to the sensing device, a plurality of through silicon vias exposing their corresponding conductive pads formed on the first bottom surface, a plurality of conductive structures formed on the first bottom surface, and a re-distribution layer overlaying the first bottom surface and each through silicon via to electrically connect each conductive pad and each conductive structure.

主权项

1. A chip scale sensing chip package, comprising:
a sensing chip, having a first top surface and a first bottom surface opposite to each other, comprising:
a sensing device formed nearby the first top surface, and a plurality of conductive pads formed nearby the first top surface and adjacent to the sensing device;a plurality of through silicon vias formed on the first bottom surface, and each of the through silicon vias exposing its corresponding conductive pad;a plurality of conductive structures, formed on the first bottom surface; anda re-distribution layer, overlaying the first bottom surface and each through silicon via to electrically connect each conductive pad and each conductive structure; a touch plate having a second top surface and a second bottom surface opposite to each other, formed above the sensing chip; and a color layer, sandwiched between the sensing chip and the touch plate.