APPARATUS AND METHOD FOR WET-PROCESSING OBJECT, AND FLUID DIFFUSION PLATE AND BARREL USED THEREIN

摘要

Disclosed are an apparatus and a method for wet-processing (such as cleaning and etching) an object such as a semiconductor wafer or substrate, and a fluid diffusion plate and a barrel used therein. The wet-processing apparatus according to the invention comprises: a treatment bath that contains and treats objects; a rod-shaped object support pipe that is installed inside the treatment bath and is able to rotate, wherein plural slots are formed on the surface of the support pipe and support the object by allowing the object to be vertically positioned at the bottom surface of the treatment bath; and a rotation unit that is connected to and rotates the support pipe to rotate the object. The support pipe comprises: a treatment fluid spray hole for spraying the treatment fluid on the object; and a treatment fluid flow path for supplying the treatment fluid to the spray hole. The invention removes a dead zone inside the treatment bath and enables the uniform and smooth flow of the treatment fluid. Therefore, treatment efficiency and uniformity can be improved.