SYSTEM AND METHOD FOR REDUCING TEMPERATURE TRANSITION IN AN ELECTROSTATIC CHUCK

摘要

A system for controlling a substrate temperature in a substrate processing system includes a substrate support device, a controller, a temperature sensor, and a thermal control element (TCE). The controller is configured to, during a first period, control the TCE to adjust the temperature of the substrate support device to a temperature value based on a temperature difference between the substrate temperature before the substrate is loaded onto the substrate support device and a desired temperature for the substrate support device. The temperature value is not equal to the desired temperature. The substrate is loaded onto the substrate support device after the first period begins and before the temperature of the substrate support device returns to the desired temperature. The controller is further configured to, during a second period following the first period, control the temperature of the substrate support device to the desired temperature for the substrate support device.

主权项

1. A system for controlling a substrate temperature in a substrate processing system, the system comprising:
a substrate support device configured to support the substrate; a temperature sensor configured to sense a temperature of the substrate support device; a thermal control element (TCE) configured to selectively heat the substrate support device; a controller configured to:
determine a temperature difference between the substrate temperature before the substrate is loaded onto the substrate support device and a desired temperature for the substrate support device;during a first period, control the TCE to adjust the temperature of the substrate support device to a temperature value based on the temperature difference, the temperature value not equal to the desired temperature for the substrate support device;wherein the substrate is loaded onto the substrate support device after the first period begins and before the temperature of the substrate support device returns to the desired temperature; andduring a second period that follows the first period, control the temperature of the substrate support device to the desired temperature for the substrate support device.