SEMICONDUCTOR PACKAGES SEPARATED USING A SACRIFICIAL MATERIAL

摘要

One or more embodiments are directed to semiconductor packages that are assembled using a sacrificial material, that when removed, separates the assembled packages into individual packages. The sacrificial material may be removed by a blanket technique such that a mask, pattern, or alignment step is not needed. In one embodiment the sacrificial material is formed on the lead frame on a connecting bar of a lead frame between adjacent leads. After the molding step, the connecting bar is etched away exposing a surface of the sacrificial material. The sacrificial material is removed, thereby separating the assembled packages into individual packages.

主权项

1. A method comprising:
coupling a first die to a first die pad; coupling a second die to a second die pad; coupling a first end of a first conductive wire to a pad of the first die and coupling a second end of the first conductive wire to a first lead; coupling a first end of a second conductive wire to a pad of the second die and coupling a second end of the second conductive wire to a second lead, the first and second leads being connected to each other by a lead connecting bar; forming a sacrificial layer on an upper surface of the lead connecting bar; encapsulating the first and second dice, the first and second conductive wires, and portions of the first and second leads and the connecting bar with encapsulation material; etching the lead connecting bar to expose a surface of the sacrificial layer; and removing the sacrificial layer using a blanket technique without a mask to form first and second semiconductor packages.