ELECTRONIC ASSEMBLY AND PROCESSING METHOD

摘要

PURPOSE: To provide an improved method for processing an integrated circuit die and to provide the improved die, an electronic assembly and an improved method for forming the assembly. CONSTITUTION: The integrated circuit die 2 has an area exposed to the upper face of aluminum forming an oxide layer 13 at an upper part. The oxide layer 13 is etched and removed for forming an opening part 12 on the aluminum area 10 at a lower part. The conductive protection layer 14 of titanium nitride is sputtered to the upper face of the die and the pad 7 of conductive heat reversible resin 15 is deposited on the opening part 12. The titanium nitride layer 14 is continuously removed by etching except for a part protected by the pad 7. The die 2 is overturned and is joined with a substrate 1 by generating electric connection between the pad 7 and a conductive area 8 on the substrate l.