| 摘要 |
PURPOSE:To provide a conductor layer forming method which can secure high bonding strength between a ceramic body and a conductor layer. CONSTITUTION:An unsintered ceramic plate 1 with a metal oxide 2 dispersed is heat-treated in reducing atmosphere, thereby reducing the metal oxide 2 dispersed therein and segregating a metal component M in the surface of the ceramic plate 1 to be able to form a layer (conductor layer). Since a metal layer is formed by segregating, high bonding strength can be obtained between the metal layer and the ceramic plate l, and therefore the separation of the metal layer is not brought about even when physical treatment or chemical treatment is applied thereto in following processes. |
