| 摘要 |
PROBLEM TO BE SOLVED: To prevent reliability in connection between the electrode pad of a wiring board and the bump electrode of a semiconductor chip from being deteriorated due to voids remaining between the wiring board and the semiconductor chip. SOLUTION: A semiconductor chip 2 in which plural bump electrodes 4 are arranged on the circuit face in an array, extended from the central part to the surrounding part is prepared. Then, sheet-shaped adhesive 5 made of thermosetting resin is adhered to one surface of the wiring board 1. Afterwards, the semiconductor chip 2 is placed through the adhesive 5 on one surface of the wiring board 1 with the circuit face of the semiconductor chip 2 facing the surface of the wiring board. Then, the semiconductor chip 2 is pressed while being heated, and the bump electrode 4 of the semiconductor chip 2 is pressure-welded to an electrode pad 1A of the wiring board 1. |
