THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT THEREOF

摘要

The thermoplastic resin composition of the present invention comprises (A) polyamide having a melting point of not lower than 280 .degree.C, particularly preferably (A-1) specific polyamide having a melting point of higher than 300 .degree.C, (B) a specific modified polymer, (C) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a TGA 10 % weight loss temperature of not lower than 300 .degree.C, and (D) a sulfur type antioxidant having a molecular weight of not less than 600 and a TGA 10 % weight loss temperature of not lower than 280 .degree.C. The molded product of the present invention is made of the above-mentioned thermoplastic resin composition. The thermoplastic resin composition of the invention is excellent in heat stability.