| 摘要 |
PROBLEM TO BE SOLVED: To produce a high-quality, good-yield and superior-thermal stability head chip with a small number of defects whose cutting resistance can be reduced by dicing along scribe lines whereat liquid supply holes are etched simultaneously when formed at a dicing time after joining a heater board wafer and a top plate wafer. SOLUTION: A silicon wafer having a front face of a <110> face is used as a material for forming a top plate 20. Simultaneously with forming liquid supply holes 21 to the silicon wafer by anisotropic etching, alignment marks and scribe lines 25 are etched to the same plane as a plane of supply ports 22 of the liquid supply holes 21, whereby the top plate wafer 2 is formed. The top plate wafer 2 is joined to the heater board wafer 1 where a plurality of heaters 11 are formed. The joined two wafers 1 and 2 are diced at the same time by dicing blades 31 along the scribe lines 25, cut and separated to individual head chips.
|
