发明名称 ETCHING LIQUID, REFILLING LIQUID, AND FORMING METHOD OF CONDUCTOR PATTERN USING IT
摘要 PROBLEM TO BE SOLVED: To provide an etching liquid and refilling liquid which can promptly etch at least one metal chosen from Ni, Cr, Ni-Cr alloy, and Pd, and a forming method of conductor pattern using it. SOLUTION: The etching liquid or a solution of water, which contains at least one component chosen from NO, N<SB>2</SB>O, NO<SB>2</SB>, N<SB>2</SB>O<SB>3</SB>and these ions, and an acid component, etches at least one metal chosen from Ni, Cr, Ni-Cr ally and Pd. The forming method of a conductor pattern (1) forms the conductor pattern (1) by etching at least one metal chosen from Ni, Cr, Ni-Cr alloy and Pd with the liquid. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006229196(A) 申请公布日期 2006.08.31
申请号 JP20050356551 申请日期 2005.12.09
申请人 MEC KK 发明人 KURIYAMA MASAYO;AKIYAMA DAISAKU
分类号 H05K3/06;C23F1/28;C23F1/30;C23F1/46 主分类号 H05K3/06
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