| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can easily remove an unnecessary thin film formed at an end edge on the surface of a substrate to be mounted and/or on the rear surface of the substrate without limiting the material of the thin film in a semiconductor device, in the mount substrate and in a liquid crystal substrate, and also to provide a method for processing a substrate. SOLUTION: The substrate processing apparatus removes a thin film formed at the end edge on the surface of a substrate 106 and/or on the rear surface of the substrate 106. The apparatus comprises a substrate holder 101 for carrying the substrate 106 to be processed thereon, an injection nozzle 104 for blowing a high temperature steam or a blast material toward the region of the substrate 106 having a thin film formed thereon and to be removed, and a means 102 for preventing the high temperature steam or the blast material blown from the injection nozzle 104 to the substrate 106 from entering the zone of the substrate 106 unnecessary to remove the thin film. COPYRIGHT: (C)2006,JPO&NCIPI
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