发明名称 POWER MODULE
摘要 PROBLEM TO BE SOLVED: To provide a power module which enables reduction of wiring resistance loss of a conductive layer in which a high speed signal pattern is formed.SOLUTION: A power module (1) includes: a substrate (10) having a first major surface (11) on which a first conductive layer (110) is formed and a second major surface (12) on which a second conductive layer (130) is formed; a power device (20) mounted on the first conductive layer (110) side; and a through electrode (120) connecting the first conductive layer (110) with the second conductive layer (130).SELECTED DRAWING: Figure 1
申请公布号 JP2016092039(A) 申请公布日期 2016.05.23
申请号 JP20140220851 申请日期 2014.10.29
申请人 SHARP CORP 发明人 ISHIHARA SEIJI;SATO TOMOTOSHI
分类号 H01L25/07;H01L23/12;H01L23/36;H01L25/18 主分类号 H01L25/07
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