| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition allowing for formation of a cured article having high heat resistance, moisture resistance and thermal shock resistance, in particular, formation of a cured article allowing for improvement of electrification property, thermal shock resistance and moisture absorption reflow property under high temperature and high temperature/high humidity, of an optical semiconductor device.SOLUTION: The curable epoxy resin composition is provided that contains an aliphatic epoxy compound (A), an adamantane compound (B) having one or more epoxy group in a molecule, a curing agent (C) and a curing accelerator (D), the curable epoxy resin composition containing a compound represented by the following formula (4) as the curing agent (C), the content of succinic acid anhydride in the total amount of the curing agent (C) being 0.4 wt.% or less. (in the formula (4), Rto Rare same or different and represent a hydrogen atom or a methyl group).SELECTED DRAWING: None |
