发明名称 Diamond-coated substrates
摘要 A composite structure, comprising a cemented carbide substrate (e.g., tungsten carbide substrate cemented with cobalt, such as WC—Co), a thin interlayer disposed over the substrate, and a contiguous diamond film disposed over the interlayer, as well as processes of preparing such a composite structure and uses thereof, are provided. The composite structure is characterized by at least one of a substrate binder concentration of at least 2 percents by weight, interlayer thickness less than 20 microns, a homogenous interlayer made substantially of crystalline chromium nitride, a low to null binder concentration in the interlayer, and a high co-adhesion of the diamond film to the interlayer and the interlayer to the substrate.
申请公布号 US9487856(B2) 申请公布日期 2016.11.08
申请号 US201314416388 申请日期 2013.07.22
申请人 Technion Research & Development Foundation Limited 发明人 Hoffman Alon
分类号 C23C16/02;C23C14/02;C23C16/27;C23C8/24;C23C14/06 主分类号 C23C16/02
代理机构 代理人
主权项 1. A composite structure, comprising a cemented carbide substrate, an interlayer disposed over said substrate and a contiguous diamond film disposed over said interlayer, wherein said cemented carbide substrate comprises a binder, and said interlayer comprises crystalline chromium nitride, the composite structure being characterized by at least one of: a thickness of said interlayer which is lower than 20 microns; a concentration of said binder in said interlayer which is lower than 0.5 percent by weight; a concentration of amorphous carbon in said interlayer which is lower than 0.5 percent by weight; and a co-adhesion of said diamond film to said interlayer and of said interlayer to said substrate, which is exhibited by a microhardness test at a load of at least 20 kg.
地址 Haifa IL
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