THERMAL MIMEOGRAPH PROCESS FOR MANUFACTURING STENCIL PAPER
摘要
<p>A thermosensitive stencil paper is composed of porous carrier (2) over one surface of which thermoplastic resinous film layer (1) is spread through adhesives (3). The porous carrier (2) and thermoplastic resinous film (1) have a point-bonded structure in which they are point-bonded to each other in a dot pattern, whereby the point-bonding structure exhibits excellent perforation characteristic. @(29pp Dwg.No.1/3)@.</p>
