Buffer layers on rolled nickel or copper as superconductor substrates

摘要

Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y2O3/Ni, YSZ/Y2O3/Ni, Yb2O3/Ni, Yb2O3/Y2O3/Ni, Yb2O3/CeO2/Ni, RE2O3/Ni (RE=Rare Earth), and Yb2O3/YSZ/CeO2/Ni, Y2O3/Cu, YSZ/Y2O3/Cu, Yb2O3/Cu, Yb2O3/Y2O3/Cu, Yb2O3/CeO2/Cu, RE2O3/Cu, and Yb2O3/YSZ/CeO2/Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approach, which includes chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.