| 摘要 |
PROBLEM TO BE SOLVED: To provide a coating material, which contains a polyamide imide resin type heat resistant resin composition as a film forming component, excellent in processing property, heat resistance and adhesion after curing at a high temperature of at least 350°C. SOLUTION: The heat resistant resin composition contains a polyamide imide resin (A) and an age resister (B). The polyamide imide resin (A) is prepared by reacting a diisocyanate compound or a diamine compound with a tribasic acid anhydride or tribasic acid anhydride chloride. The coating material contains the above heat resistant resin composition as a film forming component. COPYRIGHT: (C)2005,JPO&NCIPI
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