发明名称 |
Bond Surface Conditioning System for Improved Bondability |
摘要 |
Thick film bond surfaces on a support structure, such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit having raised bosses engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit is fit within a clamp that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder.
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申请公布号 |
US2007094867(A1) |
申请公布日期 |
2007.05.03 |
申请号 |
US20060556487 |
申请日期 |
2006.11.03 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
MALOLEPSZY SEAN M.;SAKAKINI PETER J. |
分类号 |
B23P19/00;C09J5/02;C23F1/00;H01K3/10;H01L21/31;H01L21/44;H01L21/48;H01L21/607;H01L21/66 |
主分类号 |
B23P19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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