BONDING MATERIAL FOR HONEYCOMB STRUCTURE AND HONEYCOMB STRUCTURE UTILIZING THE MATERIAL
摘要
<p>A bonding material for honeycomb structure, comprising inorganic particles of 10 to 500 D90/D10, 100 µm or less D10 and 4 µm or more D90 (wherein D10 and D90 are the values of 10% diameter and 90% diameter from the smaller particle diameter side, respectively, in volume-based cumulative fractions of a particle diameter distribution measured by a laser diffraction/scattering method).</p>
