| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive adhesive composition which cures in a short period of time by being heated and has thermal yellowing resistance.SOLUTION: The conductive adhesive composition is provided which contains the following (A) to (E) components, and in which relative to 100 pts.mass of a total of the (A) component and the (B) component, the (C) component and the (D) component are contained in amounts of 10 to 200 pts.mass and 5 to 50 pts.mass, respectively. (A) component: an epoxy resin having an alicyclic structure in one molecule. (B) component: an aromatic epoxy resin which is liquid at 25°C. (C) component: an acid anhydride. (D) component: one or more compound(s) selected from the group consisting of diazabicycloundecene or a salt thereof (D-1), diazabicyclononene or a salt thereof (D-2), and a phosphonium compound and a salt thereof (D-3). (E) component: conductive filler.SELECTED DRAWING: None |
