| 发明名称 |
ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, A DISPLAY PANEL AND METHOD FOR TESTING THE SAME, AND A DISPLAY APPARATUS |
| 摘要 |
There are provided an array substrate and method for manufacturing the same, a display panel and method for testing the same, and a display apparatus. The array substrate comprises a display region and at least one bond region located outside of the display region; wherein a plurality of signal lines are disposed within the display region, and a plurality of wiring terminals connected to multiple ones of the plurality of signal lines through a plurality of first lead wires are disposed within each bond region; the array substrate further comprises one or more test regions corresponding to arbitrary one or more of the at least one bond region; wherein a plurality of test terminals are disposed within each test region, and the plurality of test terminals within any one of the one or more test regions are connected with the plurality of wiring terminals within a respective one of the at least one bond region through a plurality of second lead wires. The present invention implements a lead wire open test for a display panel for which the lead wire open test cannot be implemented in a traditional test mode. |
| 申请公布号 |
US2016274387(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201514744459 |
申请日期 |
2015.06.19 |
| 申请人 |
Boe Technology Group Co., Ltd. ;Beijing Boe Display Technology Co., Ltd. |
发明人 |
Zheng Yaoxie;Bian Zheng;Zhu Jinwei |
| 分类号 |
G02F1/13;H01L21/66;H01L27/12 |
主分类号 |
G02F1/13 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An array substrate, comprising a display region and at least one bond region located outside of the display region;
wherein a plurality of signal lines are disposed within the display region, and a plurality of wiring terminals connected to multiple ones of the plurality of signal lines through a plurality of first lead wires are disposed within each bond region; the array substrate further comprises one or more test regions corresponding to arbitrary one or more of the at least one bond region; wherein a plurality of test terminals are disposed within each test region, and the plurality of test terminals within any one of the one or more test regions are connected with the plurality of wiring terminals within a respective one of the at least one bond region through a plurality of second lead wires. |
| 地址 |
Beijing CN |
