发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To obtain the quality of film more superior than a conventional quality of film by modifying the conventional quality of film. <P>SOLUTION: This method includes a process for forming a thin film having a predetermined thickness by setting following processes of forming a first layer and forming a second layer to one cycle and repeating the cycle at least once: the process for forming the first layer including a first element on a substrate by supplying a gas containing the first element; and the process for forming the second layer including first and second elements by supplying a gas containing the second element to modify the first layer. Pressure, or pressure and a gas supply time in one process are controlled to be higher or longer than pressure, or pressure and a gas supply time in the one process when the thin film having a stoichiometric composition is formed, or, pressure, or pressure and a gas supply time in the other process are controlled to be lower or shorter than pressure, or pressure and a gas supply time in the other process when the thin film having a stoichiometric composition is formed. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010153795(A) 申请公布日期 2010.07.08
申请号 JP20090246707 申请日期 2009.10.27
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TAKAZAWA HIROMASA;KARASAWA HAJIME;HIROSE YOSHIRO
分类号 H01L21/205;C23C16/44;H01L21/31;H01L21/318 主分类号 H01L21/205
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