主权项 |
1. A semiconductor structure, comprising:
a substrate comprising a semiconductor device, or a passive electrical element, or both, disposed therein, or thereover, or both; an electrically conductive layer disposed over the substrate, and configured to make electrical contact with the semiconductor device, or the passive electrical element, or both, the electrically conductive layer having an edge forming a perimeter of the electrically conductive layer; a moisture barrier layer disposed over the substrate and between the substrate and the electrically conductive layer; and a dielectric layer disposed over the moisture barrier layer, and between the moisture barrier layer and the electrically conductive layer, the dielectric layer having an elastic modulus that is lower than an elastic modulus of the moisture barrier layer; and an adhesion layer disposed beneath the electrically conductive layer. |