发明名称 |
FLEXIBLE TEMPERATURE COMPENSATION SYSTEMS AND METHODS FOR SUBSTRATE PROCESSING SYSTEMS |
摘要 |
A system includes memory that stores compensation information that associates process setpoint temperatures with respective adjustment values. The respective adjustment values include a first adjustment value corresponding to a first temperature compensation scheme and at least one second adjustment value corresponding to a second compensation scheme. A temperature compensation module receives a first process setpoint temperature, retrieves the compensation information from the memory based on the received first process setpoint temperature, calculates a first compensated temperature based on the received first process setpoint temperature, the first adjustment value, and the second adjustment value, and controls a temperature of a component of a substrate processing system according to the first compensated temperature. |
申请公布号 |
US2016370788(A1) |
申请公布日期 |
2016.12.22 |
申请号 |
US201514862789 |
申请日期 |
2015.09.23 |
申请人 |
Lam Research Corporation |
发明人 |
Bailey, III Andrew D.;Carbery Marcus |
分类号 |
G05B19/404 |
主分类号 |
G05B19/404 |
代理机构 |
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代理人 |
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主权项 |
1. A system, comprising:
memory that stores compensation information that associates process setpoint temperatures with respective adjustment values, wherein the respective adjustment values include a first adjustment value corresponding to a first temperature compensation scheme and at least one second adjustment value corresponding to a second compensation scheme; and a temperature compensation module that receives a first process setpoint temperature, retrieves the compensation information from the memory based on the received first process setpoint temperature, calculates a first compensated temperature based on the received first process setpoint temperature, the first adjustment value, and the second adjustment value, and controls a temperature of a component of a substrate processing system according to the first compensated temperature. |
地址 |
Fremont CA US |