LEAD FRAME AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To improve reflow crack resistance of an LSI package, and to provide a lead frame suitable for manufacture of a small quantity and a varieties of LSI packages. SOLUTION: By making an outside dimension of a die pad 3 smaller than that of a semiconductor chip 2 mounted thereon, a bonding area of the semiconductor chip 2 and resin is made large. Further, by cutting the tip of a lead 5 into an appropriate length corresponding to the outside dimension of the semiconductor chip 2, a variants of semiconductor chips 2 of different outside dimensions can be mounted on the dip pad 3.