| 摘要 |
PROBLEM TO BE SOLVED: To firmly electrically connect wiring conductors to thin-film wiring conductors and thin-film wiring conductor layers to each other, by forming an organic resin insulating layer having through holes by exposing a photosensitive organic resin precursor applied to the surface of the organic resin insulating layer, and then, developing the precursor. SOLUTION: After an organic resin insulating layer 2a and thin-film wiring conductor layers 3a are successively formed on the upper surface of a substrate 1, another organic resin insulating layer 2b having through holes 8b is formed on the surface of the insulating layer 2a including the conductor layers 3a. Then, an acid catalyst photosensitive resin precursor is applied to the upper surface of the insulating layer 2b. The resin precursor in the other area than the areas where the conductor layers 3a are applied, and in the areas where the layers 3a are applied, are successively and respectively subjected to first and second exposure. After exposure, the precursor is developed. Thereafter, thin-film conductor layers 3b are formed on the upper surface of the insulating layer 2b and, at the same time, through hole conductors 9b are formed on the internal surfaces of the through holes 8b. |
