Microelectronic-device assemblies and methods that exclude extraneous elements from sensitive areas

摘要

Microelectronic-device assemblies and methods are provided that enhance operation of microelectronic devices because they exclude extraneous elements from sensitive device areas. They are especially suited for devices that carry a plurality of bonding pads on a circuit face that has a sensitive area. A lead frame defines a paddle that has an area less than that of the device face. The paddle is spaced from the face and positioned to cover the sensitive area and expose the pads. A plastic ring is arranged to surround the sensitive area and abut the face and the paddle. Encapsulation in an overmold thus forms a void within the ring and between the device face and the paddle and extraneous elements are excluded from this void.