发明名称 |
Semiconductor integrated circuit device with capacitor formed under bonding pad |
摘要 |
A semiconductor device is provided which includes a semiconductor substrate having a main surface. A bonding pad is formed on the main surface. A multi-layer wiring structure is disposed between the main surface and the bonding pad. The multi-layer wiring structure includes a first wiring layer, a second wiring layer, and an interlayer insulating film therebetween. The first layer, the second layer, and the interlayer film form a capacitor disposed under the bonding pad.
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申请公布号 |
US6476459(B2) |
申请公布日期 |
2002.11.05 |
申请号 |
US19990352218 |
申请日期 |
1999.07.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE SANG-HEON |
分类号 |
H01L23/52;H01L21/3205;H01L21/60;H01L21/822;H01L23/48;H01L23/485;H01L23/522;H01L27/04;H01L29/94;(IPC1-7):H01L29/00;H01L21/44 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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