| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to grasp, on real time, the change of all the heating states of a plurality of printed circuit boards heated continuously. SOLUTION: The reflow soldering device is provided with: a transportation means 1 for conveying continuously printed circuit boards P where mounting components are mounted; a reflow furnace 2 surrounding the transportation means 1 for conveyed heating the printed circuit boards P; temperature detecting means 3 installed fixedly at two or more points in the transportation direction of the printed circuit boards P, for detecting the temperature of the printed circuit boards P under conveyance; and a control means 4 for managing the temperature of the conveyed printed circuit boards P. The control means 4 comprises: a memory 411 which memorizes a proper temperature at each point of all the conveyed printed circuit boards P; an input 42 for setting up tolerance to a proper temperature at each point of the conveyed printed circuit boards P; and an indicator 43 for overlap displaying with time the temperature at each point of the conveyed printed circuit boards P, detected by the temperature detecting means 3, while displaying the set-up tolerance at each point of the printed circuit boards P. COPYRIGHT: (C)2005,JPO&NCIPI |
