FIRST-SUPPLY TYPE UNDERFILL MATERIAL, ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a first-supply type underfill material having a fast hardening reaction rate in a high temperature region while having excellent thermal stability in a medium temperature region to be suppressed in the start of a hardening reaction, an electronic component device using the first-supply type underfill material, and a method for manufacturing the electronic component device.SOLUTION: A first-supply type underfill material (sealing material) 6 contains: a radical polymerizable compound; a radical polymerization initiator; and an inorganic filler that has a group having an unsaturated double bond or an inorganic filler that is surface treated by a compound having an unsaturated double bond.SELECTED DRAWING: Figure 1