CIRCUIT BOARD, PACKAGE SUBSTRATE AND ELECTRONIC DEVICE

摘要

A circuit board, and a package substrate and an electronic device that includes a circuit board are disclosed. The circuit board includes a core layer, a base pattern layer disposed on the core layer and a through-hole conductor that goes through the core layer, the base pattern layer including a circuit pattern that includes a conductive pad on the through-hole conductor, an insulator layer including at least one insulating layer stacked on the core layer and the base pattern layer, and a laminated pattern layer including a plurality of vias and a laminated circuit pattern, the plurality of vias penetrating the insulating layer, and the laminated circuit pattern being disposed on the insulating layer and including a plurality of via pads formed on the vias respectively.

主权项

1. A circuit board comprising:
a core layer; a base pattern layer disposed on said core layer and a through-hole conductor that goes through said core layer, said base pattern layer comprising a circuit pattern that comprises a conductive pad on said through-hole conductor; an insulator layer comprising at least one insulating layer stacked on said core layer and said base pattern layer; and a laminated pattern layer comprising a plurality of vias and a laminated circuit pattern, said plurality of vias penetrating said insulating layer, and said laminated circuit pattern being disposed on said insulating layer and comprising a plurality of via pads formed on said vias respectively, wherein at least one of said plurality of via pads is a common via pad formed over said conductor pad on said insulating layer; two or more of said plurality of vias are coupled to a lower part of said common via pad in parallel; two or more of said plurality of vias penetrate in parallel said insulating layers so as to constitute a parallel stack layer; and a portion of said parallel layer is coupled in parallel to said conductor pad.