| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which enables sufficient power supply to a semiconductor element to be mounted and favorably operate the semiconductor element to be mounted.SOLUTION: In a wiring board, semiconductor connection pads 10S for signal in rows on an outer periphery side in an arrangement of semiconductor element connection pads 10S are connected to external connection pads 11S for signal via belt-like lead-out interconnections 12a extending on a surface of a build-up insulation layer 6 on a top face side from positions just below the semiconductor element connection pads 10S for signal to positions just above the external connection pads 11S for signal on an outer peripheral part; and semiconductor connection pads 10S for signal in rows on an inner periphery side in the arrangement of the semiconductor element connection pads 10S are connected to external connection pads 11S for signal via belt-like lead-out interconnections 12b extending on a surface of a build-up insulation layer 6 on a bottom face side from positions just below the semiconductor element connection pads 10S for signal to positions just above the external connection pads 11A for signal on an outer peripheral part.SELECTED DRAWING: Figure 1 |
