发明名称 Polyamide composition for low temperature applications
摘要 A polyamide composition is formed from a low viscosity polyamide-6 and a nucleating agent. The nucleating agent includes an organic material, a first inorganic material and a second inorganic material. Suitable organic materials include organic polymers. Suitable inorganic metallic materials include metal oxides and silicates. The polyamide composition may include polyamide-66 materials and carbon black.
申请公布号 US9416270(B2) 申请公布日期 2016.08.16
申请号 US201214353955 申请日期 2012.05.31
申请人 Honeywell International Inc. 发明人 Huang Jianfeng;Yuan Jiayu;Wang Lei;Peng Shuwen;Wei Jie
分类号 C08L77/06;C08L77/00;C08L77/02;B65D63/10;B29C45/00;B29K77/00 主分类号 C08L77/06
代理机构 Faegre Baker Daniels LLP 代理人 Faegre Baker Daniels LLP
主权项 1. A polyamide composition comprising: at least 95 wt. % of at least one polyamide-6 material; 0.045 wt. % to 0.135 wt. % of polyamide-22; 0.005 wt. % to 0.015 wt. % of alumina silicate; 0.05 wt. % to 0.15 wt. % of an organic modified montmorillonoid clay; and 0.5 wt. % to less than 2 wt. % of at least one lubricant.
地址 Morris Plains NJ US