发明名称 |
RESIST PATTERN FORMING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a resist pattern forming method capable of suppressing occurrence of pattern collapse and forming a pattern in a good shape.SOLUTION: The resist pattern forming method includes the steps of: forming a resist film on a support by using a resist composition which generates an acid upon exposure and whose solubility in a developer changes by the action of an acid; exposing the resist film; and patterning the resist film after exposure by negative development using a developer containing an organic solvent to form a resist pattern. As the resist composition, a resist composition which contains a polymer compound having a constituent unit (a0) represented by formula (a0) and a constituent unit (a1) containing an acid-decomposable group whose polarity increases by the action of an acid is used.SELECTED DRAWING: None |
申请公布号 |
JP2016148718(A) |
申请公布日期 |
2016.08.18 |
申请号 |
JP20150024141 |
申请日期 |
2015.02.10 |
申请人 |
TOKYO OHKA KOGYO CO LTD |
发明人 |
TSUCHIYA JUNICHI;MORI YOSHITAKA |
分类号 |
G03F7/038;C08F220/00;G03F7/039;G03F7/32;H01L21/027 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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