发明名称 |
PLASTIC COOLER FOR SEMICONDUCTOR MODULES |
摘要 |
A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of each module to form a multi-die module. The plastic housing includes a first singular plastic part which receives the modules and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates. |
申请公布号 |
US2016260654(A1) |
申请公布日期 |
2016.09.08 |
申请号 |
US201514636256 |
申请日期 |
2015.03.03 |
申请人 |
Infineon Technologies AG |
发明人 |
Yoo Inpil;Grassmann Andreas |
分类号 |
H01L23/473;H01L21/54;H01L23/18;H01L23/498;H01L21/48 |
主分类号 |
H01L23/473 |
代理机构 |
|
代理人 |
|
主权项 |
1. A cooling apparatus, comprising:
a plurality of discrete modules each of which comprises:
a semiconductor die encapsulated by a mold compound;a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound; anda first cooling plate at least partly uncovered by the mold compound; and a plastic housing surrounding a periphery of each module to form a multi-die module, the plastic housing comprising:
a first singular plastic part which receives the modules; anda second singular plastic part attached to a periphery of the first plastic part, the second plastic part having cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates. |
地址 |
Neubiberg DE |