| 发明名称 |
SEALING EPOXY RESIN COMPOSITION, HARDENED PRODUCT, AND SEMICONDUCTOR DEVICE |
| 摘要 |
A sealing epoxy resin composition contains a phosphonium salt shown in Formula (1), an epoxy resin, a hardening agent, and an inorganic filler. In Formula (1), R1-R3 each represent an aryl group having 6 to 12 carbon atoms, R4 represents an alkyl group having 1 to 4 carbon atoms, R6 and R8 each represent either a carboxyl group or a hydroxyl group, R5 and R7 each represent either hydrogen or an alkyl group having 1 to 4 carbon atoms, R9 and R11 represent hydrogen, R10 represents either a carboxyl group or a hydroxyl group, and the relation of r≦1 is satisfied. |
| 申请公布号 |
US2016260645(A1) |
申请公布日期 |
2016.09.08 |
| 申请号 |
US201615154956 |
申请日期 |
2016.05.14 |
| 申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
OGAWA KAZUTO;NISHIDONO KYOKO;IWATANI EMI;TAKAGI KEIGO |
| 分类号 |
H01L23/29;C09J163/00 |
主分类号 |
H01L23/29 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sealing epoxy resin composition comprising:
a phosphonium salt shown in Formula (1); an epoxy resin; a hardening agent; and an inorganic filler, where R1-R3 are independent and each represent an aryl group having 6 to 12 carbon atoms; R4 represents an alkyl group having 1 to 4 carbon atoms; R6 and R8 are independent and each represent either a carboxyl group or a hydroxyl group; R5 and R7 are independent and each represent either hydrogen or an alkyl group having 1 to 4 carbon atoms; R9 and R11 represent hydrogen; R10 represents either a carboxyl group or a hydroxyl group; and a relation of r≦1 is satisfied. |
| 地址 |
Osaka JP |
