| 发明名称 |
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCTURES |
| 摘要 |
Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam. |
| 申请公布号 |
US2016264410(A1) |
申请公布日期 |
2016.09.15 |
| 申请号 |
US201615162997 |
申请日期 |
2016.05.24 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Brigham Michael T.;Jahnes Christopher V.;Luce Cameron E.;Maling Jeffrey C.;Murphy William J.;Stamper Anthony K.;White Eric J. |
| 分类号 |
B81C1/00 |
主分类号 |
B81C1/00 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A method comprising forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and semiconductor material at least above and below the MEMS beam structure to form an upper cavity structure above the MEMS beam structure and a lower cavity structure below the MEMS beam structure,
wherein the MEMS beam structure comprises a cantilevered beam structure, and wherein the tungsten material above the MEMS beam structure is formed in seams formed in the semiconductor material above the MEMS beam, and the venting begins with the semiconductor material above the MEMS beams structure. |
| 地址 |
Armonk NY US |
