MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCTURES

摘要

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.

主权项

1. A method comprising:
forming a Micro-Electro-Mechanical System (MEMS) beam structure comprising: forming both tungsten material and semiconductor material below the MEMS beam structure;
forming both the tungsten material and the semiconductor material above the MEMS beam structure;forming a lid over the tungsten material formed above the MEMS beam structure;forming at least one vent hole in the lid and through the tungsten material formed above the MEMS beam structure to expose the semiconductor material formed above the MEMS beam structure; andventing the semiconductor material formed above the MEMS beam structure while venting the tungsten material formed above the MEMS beam structure to form an upper cavity structure above the MEMS beam structure; andventing both the tungsten material and the semiconductor material below the MEMS beam structure to form a lower cavity structure below the MEMS beam structure, wherein the MEMS beam structure comprises a cantilevered beam structure.