发明名称 |
HEAT DISSIPATION FIN AND HEAT SINK, MODULE MOUNTING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation fin capable of reducing the fluid resistance and enhancing the heat-transfer performance, and a heat sink and a module mounting the same.SOLUTION: A heat sink 40 is constituted of a smooth plate 10 that is a base composed of a metal, and a heat dissipation fin 23 mounted on the smooth plate 10 via metallic bond. The heat dissipation fin 23 has a structure of a porous metal 22 consisting of fine wires 20 composed of a metal and cavities 21. The fine wire 20 has a front surface part of curved surface shape against the flow direction of the fluid 30 which a fluid 30 strikes, and a rear surface part elongated so that the flow of the fluid 30 does not exfoliate easily.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016174025(A) |
申请公布日期 |
2016.09.29 |
申请号 |
JP20150052231 |
申请日期 |
2015.03.16 |
申请人 |
HITACHI CHEMICAL CO LTD |
发明人 |
KONDO YOSHIHIRO;KOSHIDA HIROYUKI |
分类号 |
H01L23/473;F28D15/02;H05K7/20 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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