| 摘要 |
<P>PROBLEM TO BE SOLVED: To alleviate differences in contraction forces of a sealing resin to reduce strain on a package even when electronic components are unevenly positioned on a substrate. <P>SOLUTION: An electronic device (100) includes a substrate 102, the electronic components (104, 108) mounted on one face of the substrate 102, and a sealing resin 118 formed on the one face of the substrate 102 to seal the electronic components. The sealing resin 118 includes a first resin region 120 formed of a first resin composition and a second resin region 122 formed of a second resin composition, and is formed to have, as seen in planar view, a region in which only the first resin region 120 exists and a region in which only the second resin region 122 exists. <P>COPYRIGHT: (C)2010,JPO&INPIT |
